Liquid crystal display device and method for fabricating the same

ABSTRACT

An LCD device and a method for fabricating the same is disclosed that improves a yield by decreasing processing time. The LCD device includes gate and data lines formed substantially perpendicular to each other on a substrate and defining a unit pixel region; a thin film transistor formed at a crossing of the gate and data lines; an active layer formed over the gate line, the data line, and the thin film transistor; an organic resin formed on a portion of a gate insulating layer not including the gate line, the data line, and the thin film transistor; a passivation layer formed on an entire surface of the substrate including the thin film transistor; and a pixel electrode, formed in the unit pixel region, the pixel electrode being connected with a drain electrode of the thin film transistor.

This application claims the benefit of the Korean Patent Application No.P2005-0037874, filed on May 6, 2005, which is hereby incorporated byreference as if fully set forth herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a liquid crystal display LCD device,and more particularly, to an LCD device and a method for fabricating thesame to improve a yield with a decreased process time.

2. Discussion of the Related Art

Recent efforts have been made to research and develop various types offlat display devices, such as liquid crystal display (LCD), plasmadisplay panel (PDP), electroluminescent display (ELD), and vacuumfluorescent display (VFD). Some types of flat display devices havealready been used as displays in various applications.

Among the types of flat display devices, liquid crystal display (LCD)devices have been most widely used due to its advantageouscharacteristics of thin profile, lightness in weight, and low powerconsumption, whereby the LCD devices provides a substitute for a CathodeRay Tube (CRT). In addition to mobile type LCD devices such as a displayfor a notebook computer, LCD devices have been developed for computermonitors and televisions to receive and display broadcasting signals.

Despite various technical developments in the LCD technology havingapplications in different fields, research in enhancing the picturequality of the LCD device has been, in some respects, lacking ascompared to other features and advantages of the LCD device. In order touse LCD devices in various fields as a general display, the key todeveloping LCD devices depends on whether LCD devices can realize a highquality picture, such as high resolution and high luminance with alarge-sized screen, while still maintaining lightness in weight, thinprofile, and low power consumption.

Generally, the LCD device includes an LCD panel for displaying a pictureimage, and a driving part for applying a driving signal to the LCDpanel. The LCD panel includes first and second glass substrates beingbonded to each other at a predetermined interval therebetween, and aliquid crystal layer formed between the first and second glasssubstrates by injection of liquid crystal.

The first glass substrate (TFT array substrate) includes a plurality ofgate and data lines, a plurality of pixel electrodes, and a plurality ofthin film transistors. The plurality of gate lines are formed at fixedintervals in a first direction on the first glass substrate, and theplurality of data lines are formed at fixed intervals in a seconddirection perpendicular to the first direction. Then, the plurality ofpixel electrodes, which are arranged in a matrix-type configuration, arerespectively formed in pixel regions defined by the plurality of gateand data lines crossing each other. The plurality of thin filmtransistors are switched according to signals of the gate lines fortransmitting signals of the data lines to the respective pixelelectrodes.

The second glass substrate (color filter substrate) includes a blackmatrix layer that excludes light from regions except the pixel regionsof the first substrate, R(red)/G(green)/B(blue) color filter layerdisplaying various colors, and a common electrode to obtain the pictureimage. In a case of an In-Plane Switching (IPS) mode LCD device, thecommon electrode is formed on the first glass substrate.

Next, a predetermined space is maintained between the first and secondglass substrates by spacers, and the first and second substrates arebonded to each other by a seal pattern having a liquid crystal injectioninlet. At this time, the liquid crystal layer is formed according to aliquid crystal injection method, in which the liquid crystal injectioninlet is dipped into a vessel having liquid crystal while maintaining avacuum state in the predetermined space between the first and secondglass substrates. That is, the liquid crystal is injected between thefirst and second substrates by an osmotic action. Then, the liquidcrystal injection inlet is sealed with a sealant.

Meanwhile, the LCD device is driven according to the optical anisotropyand polarizability of liquid crystal material. Liquid crystal moleculesare aligned using directional characteristics because the liquid crystalmolecules each has long and thin shapes. In this respect, an inducedelectric field is applied to the liquid crystal for controlling thealignment direction of the liquid crystal molecules. That is, if thealignment direction of the liquid crystal molecules is controlled by theinduced electric field, the light is polarized and changed by theoptical anisotropy of the liquid crystal, thereby displaying the pictureimage. In this state, the liquid crystal is classified into positive (+)type liquid crystal having positive dielectric anisotropy and negative(−) type liquid crystal having negative dielectric anisotropy accordingto electrical characteristics of the liquid crystal. In the positive (+)type liquid crystal, a longitudinal (major) axis of a positive (+)liquid crystal molecule is arranged in parallel to the electric fieldapplied to the liquid crystal. Meanwhile, in the negative (−) typeliquid crystal, a longitudinal (major) axis of a negative (−) liquidcrystal molecule is arranged in perpendicular to the electric fieldapplied to the liquid crystal.

Hereinafter, a related art LCD device will be described with referenceto the accompanying drawings.

FIG. 1 illustrates an expanded plan view of a unit pixel of an LCDdevice according to the related art. FIG. 2 illustrates a crosssectional view along I-I′ of FIG. 1. FIGS. 3A to 3E illustrate crosssectional views of a process for fabricating an LCD device according tothe related art.

As shown in FIGS. 1 and 2, the LCD device according to the related artincludes a lower substrate 20 and an upper substrate. The lowersubstrate 20 includes a gate line 21, a data line 24, a pixel electrode27, and a thin film transistor TFT. The gate line 21 is formedperpendicular to the data line 24, to define a unit pixel region P.Also, the pixel electrode 27 is formed in the unit pixel region P, andthe thin film transistor TFT is formed at a crossing of the gate anddata lines 21 and 24.

The thin film transistor TFT is comprised of a gate electrode 21 a, agate insulating layer 22, an active layer 23, a source electrode 24 a,and a drain electrode 24 b. The gate electrode 21 a protrudes from thegate line 21, and the gate insulating layer 22 is formed on an entiresurface of the lower substrate 20. Then, the active layer 23 is formedon the gate insulating layer 22 over the gate electrode 21 a. The sourceelectrode 24 a, which protrudes from the data line 24, overlaps one sideof the active layer 23. The drain electrode 24 b, which is formed at apredetermined interval from the source electrode 24 a, overlaps theother side of the active layer 23. In addition, an ohmic contact layer23 a is formed between the active layer 23 and the source electrode 24a, and between the active layer 23 and the drain electrode 24 b.

Furthermore, a first storage electrode 24 c is formed on the gateinsulating layer 22 above a preceding gate line.

A passivation layer 25 is formed on the entire surface of the lowersubstrate 20 including the thin film transistor TFT. Also, a firstcontact hole 26 a is formed in a predetermined portion of the drainelectrode 24 b, and a second contact hole 26 b is formed in apredetermined portion of the first storage electrode 24 c.

A pixel electrode 27 is formed in the pixel region on the passivationlayer 25 such that the pixel electrode 27 is connected with the drainelectrode 24 b through the first contact hole 26 a. Also, a secondstorage electrode 28 is formed by extending the pixel electrode to thepreceding gate line including the second contact hole 26 b.

The pixel electrode 27 and the second storage electrode 28 are formed ofa transparent conductive metal having a great transmittance of light,for example, indium-tin-oxide ITO.

Although not shown, the upper substrate is formed opposite to the lowersubstrate 20. The upper substrate includes a black matrix layer, an RGBcolor filter layer, and a common electrode. The black matrix layer isprovided to prevent light from leaking in other portions except thepixel region P. The RGB color filter layer is formed to representcolors, and the common electrode is formed to realize images.

A method for fabricating the LCD device according to the related artwill be described as follows.

First, as shown in FIG. 3A, a conductive metal is coated on thetransparent lower substrate 20, and is then patterned byphotolithography using a first mask. As a result, the gate line 21 isformed in one direction on the lower substrate 20. In this state, thegate electrode 21 a is formed at one side of the gate line 21.

After that, as shown in FIG. 3B, the gate insulating layer 22 is formedon the entire surface of the lower substrate 20 including the gate line21. At this time, the gate insulating layer 22 may be formed of siliconnitride SiN_(x) or silicon oxide SiO₂.

After that, a semiconductor layer (mixture of amorphous silicon andimpurity amorphous silicon) is formed on the gate insulating layer 22.

Subsequently, the semiconductor layer is patterned by photolithographyusing a second mask. Thus, the active layer 23 of an island shape isformed above the gate electrode 21 a.

After that, as shown in FIG. 3C, a conductive metal is deposited on theentire surface of the lower substrate 20 including the active layer 23,and is then patterned by photolithography using a third mask. As aresult, the data line 24 is formed perpendicular to the gate line 21,the source electrode 24 a which protrudes from one side of the data line24 overlaps one side of the active layer 23, and the drain electrode 24b overlaps the other side of the active layer 23. At this time, thedrain electrode 24 b is formed at a predetermined interval from thesource electrode 24 a. Also, the first storage electrode 24 c is formedabove a predetermined portion of the preceding gate line 21.

When etching the data line 24, the source electrode 24 a, and the drainelectrode 24 b, the impurity amorphous silicon is over-etched. Thus, theohmic contact layer 23 a is formed between the source electrode 24 a andthe active layer 23, and between the drain electrode 24 b and the activelayer 23.

In the above process, the gate line 21 is formed perpendicular to thedata line 24, thereby defining the pixel region P.

As shown in FIG. 3D, the passivation layer 25 is deposited on the entiresurface of the lower substrate 20 including the data line 24.Subsequently, the first and second contact holes 26 a and 26 b areformed to expose the drain electrode 24 b and the first storageelectrode 24 c, respectively.

Referring to FIG. 3E, a transparent conductive layer is deposited on thepassivation layer 25, and is selectively removed by photolithographyusing a fifth mask, thereby forming the pixel electrode 27 in the pixelregion. The pixel electrode 27 of the transparent conductive layerextends to the preceding gate line including the second contact hole 26b, thereby forming the second storage electrode 28.

Through the above-mentioned process according to the related art, thefive masks are totally required so that it has a limitation inimprovement of yield.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to an LCD device and amethod for fabricating the same that substantially obviates one or moreproblems due to limitations and disadvantages of the related art.

An advantage of the present invention is to provide an LCD device and amethod for fabricating the same to improve a yield by decreasing aprocess time.

Additional advantages and features of the invention will be set forth inthe description which follows, and in part will be apparent from thedescription, or may be learned by practice of the invention. These andother advantages of the invention will be realized and attained by thestructure particularly pointed out in the written description and claimshereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purposeof the invention, as embodied and broadly described herein, an LCDdevice includes gate and data lines formed substantially perpendicularto each other on a substrate and defining a unit pixel region; a thinfilm transistor formed at a crossing of the gate and data lines; anactive layer formed over the gate line, the data line, and the thin filmtransistor; an organic resin formed on a portion of a gate insulatinglayer not including the gate line, the data line, and the thin filmtransistor; a passivation layer formed on an entire surface of thesubstrate including the thin film transistor; and a pixel electrode,formed in the unit pixel region and connected with a drain electrode ofthe thin film transistor.

In another aspect of the present invention, a method for fabricating anLCD device includes forming a gate line including a gate electrode on asubstrate; forming a gate insulating layer on the substrate includingthe gate line; forming a data line substantially perpendicular to thegate line and defining a unit pixel region, wherein source and drainelectrodes respectively overlap both sides of the gate electrode;forming an insulating organic resin on a portion of the gate insulatinglayer not including the gate electrode, the gate line, the data line,the source electrode, and the drain electrode; forming an active layeron portions of the substrate except the organic resin; forming apassivation layer on an entire surface of the substrate including thedata line; and forming a pixel electrode in the pixel region, whereinthe pixel electrode being contacts the drain electrode.

It is to be understood that both the foregoing general description andthe following detailed description of the present invention areexemplary and explanatory and are intended to provide furtherexplanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification; illustrate embodiments of the invention andtogether with the description serve to explain the principle of theinvention. In the drawings:

FIG. 1 illustrates an expanded plan view of a unit pixel of an LCDdevice according to the related art;

FIG. 2 illustrates a cross sectional view along I-I′ of FIG. 1;

FIGS. 3A to 3E illustrate cross sectional views of a process forfabricating an LCD device according to the related art;

FIG. 4 illustrates an expanded plan view of a unit pixel of an LCDdevice according to an embodiment of the present invention;

FIG. 5 illustrates a cross sectional view along II-II′ of FIG. 4;

FIGS. 6A to 6E illustrate cross sectional views of a process forfabricating an LCD device according to an embodiment of the presentinvention; and

FIGS. 7A to 7E illustrate plan views for a process of fabricating an LCDdevice according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

Reference will now be made in detail to the preferred embodiments of thepresent invention, examples of which are illustrated in the accompanyingdrawings.

Hereinafter, an LCD device and a method for fabricating the sameaccording to the present invention will be described with reference tothe accompanying drawings.

First, an LCD device according to the present invention will bedescribed.

FIG. 4 illustrates an expanded plan view of a unit pixel of an LCDdevice according to an embodiment of the present invention. FIG. 5illustrates a cross sectional view along II-II′ of FIG. 4.

As shown in FIG. 4 and FIG. 5, a gate line 61 and a data line 63 areformed on a lower substrate 60, wherein the gate line 61 is formedsubstantially perpendicular to the data line 63 to define a unit pixelregion P. Then, a pixel electrode 68 is formed in the unit pixel regionP, and a thin film transistor TFT is formed at a crossing of the gateand data line 61 and 63.

The thin film transistor TFT is comprised of a gate electrode 61 a, agate insulating layer 62, a source electrode 63 a, a drain electrode 63b, and an active layer 65. The gate electrode 61 a protrudes from thegate line 61, and the gate insulating layer 62 is formed on an entiresurface of the lower substrate 60. Also, the source electrode 63 a whichprotrudes from the data line 63 overlapped with one side of the gateelectrode 61 a. The drain electrode 63 b is overlapped with the otherside of the gate electrode 61 a. The source electrode 63 a is formed ata predetermined interval from the drain electrode 63 b. Then, the activelayer 65 is formed over the gate electrode 61 a, the source electrode 63a, and the drain electrode 63 b.

The active layer 65 is formed in correspondence with the gate line 61,the gate electrode 61 a, the data line 63, the source electrode 63 a,and the drain electrode 63 b.

The active layer 65 is formed of an organic semiconductor material suchas pentacene and a nano-semiconductor material floating in apredetermined liquid.

Also, an insulating organic resin 64 is coated on the gate insulatinglayer 62 except the active layer 65. The insulating organic resin 64 ishardened by UV irradiation. For example, the insulating organic resin 64is formed by hardening acryl base or epoxy base.

Then, a first storage electrode is formed on the gate insulating layer62 above preceding gate line.

After that, a passivation layer 66 is formed on the entire surface ofthe lower substrate 60 including the thin film transistor TFT. Also, thepassivation layer 66 and the active layer 65 are etched in thepredetermined portions of the drain electrode 63 b and the first storageelectrode 63 c, thereby forming first and second contact holes 67 a and67 b.

Also, the active layer 65 and the passivation layer 66 which are formedabove the gate line 61 adjacent to the data line 63 are also etched andpatterned. By removing the active layer 65 formed above the gate line 61adjacent to the data line 63, it is possible to remove noise causedbetween each data line 63.

The pixel electrode 68 is formed on the passivation layer 66 incorrespondence with the pixel region. Also, the pixel electrode 68 isconnected with the drain electrode 63 b through the first contact hole67 a.

Also, a second storage electrode 68 b is formed by extending the pixelelectrode 68 to the preceding gate line, for being connected with thefirst storage electrode 63 c through the second contact hole 67 b.

At this time, the pixel electrode 68 and the second storage electrode 68a are formed of transparent conductive metal having a great lighttransmittance, for example, indium-tin-oxide ITO, tin-oxide TO,indium-zinc-oxide IZO, or indium-tin-zinc-oxide ITZO.

Although not shown, an upper substrate is formed opposite to the lowersubstrate. The upper substrate includes a black matrix layer forpreventing light leakage in other portions except the pixel region P, anRGB color filter layer for representing colors, and a common electrodefor realizing images.

A method for fabricating the LCD device according to the presentinvention will be described as follows.

FIGS. 6A to 6E illustrate cross sectional views of a process forfabricating the LCD device according to an embodiment of the presentinvention. FIGS. 7A to 7E illustrate plan views for a process offabricating the LCD device according to the embodiments of the presentinvention.

First, as shown in FIG. 6A and FIG. 7A, a conductive metal is depositedon the transparent lower substrate 60, and is then patterned byphotolithography using a first mask, thereby forming the gate line 61 inone direction. The gate electrode 61 a protrudes from one side of thegate line 61.

After that, the gate insulating layer 62 is formed on the entire surfaceof the lower substrate 60 including the gate line 61. The gateinsulating layer 62 may be formed of silicon nitride SiN_(x) or siliconoxide SiO₂.

Then, a conductive metal is deposited on the gate insulating layer 62,and is then patterned by photolithograph using a second mask, therebyforming the data line 63, the source electrode 63 a, and the drainelectrode 63 b. The data line 63 is formed substantially perpendicularto the gate line 61. Also, the source electrode 63 a which protrudesfrom one side of the data line 63 overlaps one side of the gateelectrode 61 a. The drain electrode 63 b overlaps the other side of thegate electrode 61 a, wherein the drain electrode 63 b is formed at apredetermined interval from the source electrode 63 a. At this time, thefirst storage electrode 63 c is formed on the predetermined portion of apreceding gate line 61.

In the above-mentioned process, the gate line 61 is formed substantiallyperpendicular to the data line 63, thereby defining the unit pixelregion P.

Referring to FIG. 6B and FIG. 7B, an insulating organic resin 64, whichis a solution hardened by UV irradiation, is coated on the entiresurface of the lower substrate 60 including the data line 63. Forexample, acryl base or epoxy base may be coated on the entire surface ofthe lower substrate 60 including the data line 63. The insulatingorganic resin 64 is transparent, and is a negative type in which thepredetermined portion irradiated with UV rays remains.

Next, as shown in FIG. 6C and FIG. 7C, the coated organic resin 64 isirradiated with UV rays from a rear surface of the lower substrate 60.

As applying UV rays to the rear surface of the lower substrate, theorganic resin 64 positioned over the gate line 61, the gate electrode 61a, the data line 63, the source electrode 63 a, and the drain electrode63 b is not hardened since it is not irradiated with UV rays, and theorganic resin of the remaining portions is hardened.

After that, the organic resin 64 which is not hardened by UV rays isremoved.

Subsequently, as shown in FIG. 6D and FIG. 7D, a liquid material, whichis formed of a solvent having a semiconductor material dispersedlyfloating, is coated on the entire surface of the lower substrate 60. Atthis time, the liquid material includes an organic semiconductor such aspentacene.

The liquid material is coated only on a surface having a hydrophilicproperty except the organic resin 64 having a hydrophobic property.Then, a heat treatment is performed to the coated liquid material. Thus,the solvent is vaporized, and only the semiconductor material remains.As a result, the active layer 65 is formed over the gate line 61, thegate electrode 61 a, the data line 63, the source electrode 63 a, andthe drain electrode 63 b.

After that, as shown in FIG. 6E and FIG. 7E, the passivation layer 66 isdeposited on the entire surface of the lower substrate 60 including theactive layer 65. At this time, the passivation layer 66 may be formed ofat least any one of oxide, nitride, photo acryl, polyimide, andBenzoCycloButene BCB.

Subsequently, the passivation layer 66 is patterned by photolithographusing a third mask, thereby forming the first and second contact holes67 a and 67 b for respectively exposing the predetermined portions ofthe drain electrode 63 c and the first storage electrode 63 c.

When forming the first and second contact holes 67 a and 67 b, theactive layer 65 and the passivation layer 66 positioned above the gateline 61 adjacent to the data line 63 are also removed. As a result, itis possible to minimize noise caused by the active layer adjacent to thedata line 63.

After that, a transparent conductive layer is deposited on thepassivation layer 66, and is selectively removed by photolithographusing a fourth mask, thereby forming the pixel electrode 68 in the pixelregion P.

The transparent conductive layer is connected with the first storageelectrode 63 c through the second contact hole 67 a. Also, thetransparent conductive layer extends to the preceding gate lineincluding the first storage electrode 63 c, thereby forming the secondstorage electrode 68 a.

According to the above-mentioned method, it is possible to form astorage-on-gate structure of a storage capacitor.

The transparent conductive layer may be formed of indium-tin-oxide ITO,tin-oxide TO, indium-zinc-oxide IZO, or indium-tin-zinc-oxide ITZO.

Although not shown, an alignment layer is formed on the entire surfaceof the lower substrate 60 including the pixel electrode 68. Thealignment layer may be formed of a photo-alignment material orpolyimide.

If the alignment layer is formed of polyimide, an alignment directionthereof is determined by a mechanical rubbing method. If the alignmentmaterial is formed of a photo-alignment material such as apolyvinylcinnamate-based material) or a polysiloxane-based material, analignment direction thereof is determined by UV irradiation. At thistime, the alignment direction is determined depending on the directionand property of light irradiated, that is, a polarizing direction.

As mentioned above, the LCD device and the method for fabricating thesame according to the present invention have the following advantages.

In the method for fabricating the LCD device according to the presentinvention, the active layer can be formed by exposure of the rearsurface and the liquid material without a mask. Accordingly, it ispossible to obtain a simplified process with a decreased number ofmasks, thereby improving the yield.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present inventionwithout departing from the spirit or scope of the invention. Thus, it isintended that the present invention cover the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

1. An LCD device comprising: gate and data lines formed substantiallyperpendicular to each other on a substrate and defining a unit pixelregion; a thin film transistor formed at a crossing of the gate and datalines; an active layer formed over the gate line, the data line, and thethin film transistor; an organic resin formed on a portion of a gateinsulating layer not including the gate line, the data line, and thethin film transistor; a passivation layer formed on an entire surface ofthe substrate including the thin film transistor; and a pixel electrode,formed in the unit pixel region, the pixel electrode being connectedwith a drain electrode of the thin film transistor.
 2. The LCD device ofclaim 1, wherein the active layer is selectively removed above andinsulated from the gate line adjacent to the data line.
 3. The LCDdevice of claim 1, wherein the thin film transistor includes: a gateelectrode protruding from the gate line; the gate insulating layerformed on the entire surface of the substrate; a source electrodeprotruding from the data line overlapping one side of the gateelectrode; the drain electrode overlapping another side of the gateelectrode, and formed at a predetermined interval from the sourceelectrode; and the active layer formed over the gate electrode, thesource electrode, and the drain electrode.
 4. The LCD device of claim 1,wherein the active layer is formed of an organic semiconductor materialand a nano-semiconductor material floating in a predetermined liquid. 5.The LCD device of claim 4, wherein the organic semiconductor materialincludes pentacene.
 6. The LCD device of claim 1, further comprising: afirst storage electrode formed on the gate insulating layer above apreceding gate line; and first and second contact holes formed inpredetermined portions of the drain electrode and the first storageelectrode.
 7. The LCD device of claim 6, further comprising: a secondstorage electrode formed by extending the pixel electrode to thepreceding gate line, wherein the second storage electrode is connectedwith the first storage electrode through the second contact hole.
 8. TheLCD device of claim 7, wherein the pixel electrode and the secondstorage electrode are formed of transparent conductive metal having ahigh light transmittance.
 9. The LCD device of claim 8, wherein thetransparent conductive metal includes one of indium-tin-oxide (ITO),tin-oxide (TO), indium-zinc-oxide (IZO), or indium-tin-zinc-oxide(ITZO).
 10. The LCD device of claim 1, wherein the organic resin has aninsulating property, wherein the organic resin is formed of acryl baseor epoxy base hardened by UV rays.
 11. A method for fabricating an LCDdevice comprising: forming a gate line including a gate electrode on asubstrate; forming a gate insulating layer on the substrate includingthe gate line; forming a data line substantially perpendicular to thegate line and defining a unit pixel region, wherein source and drainelectrodes respectively overlap both sides of the gate electrode;forming an insulating organic resin on a portion of the gate insulatinglayer not including the gate electrode, the gate line, the data line,the source electrode, and the drain electrode; forming an active layeron portions of the substrate except the organic resin; forming apassivation layer on an entire surface of the substrate including thedata line; and forming a pixel electrode in the pixel region, whereinthe pixel electrode contacts the drain electrode.
 12. The method ofclaim 11, further comprising: coating the insulating organic resin,which is hardened by UV irradiation, on the entire surface of thesubstrate; applying UV rays to a rear surface of the substrate; andremoving the insulating organic resin not hardened by the UVirradiation.
 13. The method of claim 11, wherein the insulating organicresin is formed of acryl base or epoxy base.
 14. The method of claim 11,further comprising: coating a liquid material, which is a solvent havinga semiconductor material dispersedly floating, on the entire surface ofthe substrate; and performing a heat treatment to the coated liquidmaterial to vaporize the solvent.
 15. The method of claim 14, whereinthe liquid material includes an organic semiconductor material includingpentacene.
 16. The method of claim 11, wherein the passivation layer isformed of at least one of oxide, nitride, photo acryl, polyimide, andBenzoCycloButene (BCB).
 17. The method of claim 11, further comprisingforming a first storage electrode in a predetermined portion above apreceding gate line, wherein the first storage electrode is formed withwhen forming the data line, the source electrode, and the drainelectrode.
 18. The method of claim 17, further comprising forming firstand second contact holes for respectively exposing predeterminedportions of the drain electrode and the first storage electrode bypatterning the passivation layer.
 19. The method of claim 18, whereinthe active layer and the passivation layer positioned over the gate lineadjacent to the data line are removed when forming the first and secondcontact holes.
 20. The method of claim 18, further comprising forming asecond storage electrode extending from the pixel electrode to thepreceding gate line, wherein the second storage electrode is connectedwith the first storage electrode through the second contact hole, whenforming the pixel electrode.